Semiconductor Packaging News
A research team led by Hyeong-U Kim at KIMM has achieved a world-first: fabricating 4-inch heterostructure semiconductors using PECVD technology. This innovation enables low-power, high-performance AI semiconductors, enhancing efficiency & …
Semiconductor Packaging News
Advanced Packaging Driving New Collaboration Across Supply Chain. The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges.
Semiconductor Packaging News Index
Although House Speaker Johnson initially suggested ... CNBC. Nov 8, 2024. SUMMARY. Semiconductor firms ASML, AMD, Qualcomm reaffirm China commitment at CIIE trade fair. At Shanghai's CIIE trade fair, global semiconductor giants like ASML, AMD, and Qualcomm showcased advanced tech products, reaffirming their commitment ... South China Morning Post.
Semiconductor Packaging News
October 31, 2024. Back-end Semiconductor Equipment: Advanced Packaging to Propel the Market. The back-end semiconductor equipment market, essential for assembly and packaging, is set to grow in 2025, driven by AI investments and advanced packaging demands. Despite recent declines, revenue should rebound as AI and high-performance computing ...
Semiconductor Packaging News
The Biden-Harris Administration announced a $1.6 billion funding opportunity under the CHIPS and Science Act to boost advanced semiconductor packaging in the U.S. This investment aims to enhance performance and competitiveness in microelectronics, addressing key …
The Evolution of Interconnects in Microelectronics Packaging
19 hours ago · The Evolution of Interconnects in Microelectronics Packaging. Advances in semiconductor packaging, including hybrid bonding and heterogeneous integration, push critical interconnect innovations like direct copper & solder alternatives, boosting signal integrity. These breakthroughs fuel miniaturization & enhance performance in flexible electronics.
Advanced Packaging Driving New Collaboration Across Supply Chain
Advanced Packaging Driving New Collaboration Across Supply Chain. Summary. The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges.
Semiconductor Packaging News
Game-Changing Solutions for Power Module and Semiconductor Production with Plasma Technology Plasmatreat GmbH is excited to announce its first participation at the electronica and SEMICON Europa in hall C5 at booth 169.
Semiconductor Packaging Press Release Index
Nov 5, 2024. EV Group Announces Management Board Expansion In Light Of Unabated Growth. EV Group (EVG) announced the expansion of its management board. To further strengthen the company’s position in semiconductor and adjacent markets, Alexander ... EV Group. Semiconductor Packaging Press Release Index.
Semiconductor Packaging News Viewpoint Index
VIEWPOINT 2024: Eelco Bergman, Chief Business Officer, Saras Micro Devices, Inc. Feb 22, 2024. VIEWPOINT 2024: Mohan Iyer, Vice President and General Manager of Semiconductor, Thermo Fisher Scientific. Feb 21, 2024. VIEWPOINT 2024: Glenn Farris, Vice President, Global Customer Operations and Corporate Marketing, Universal Instruments.