Feb 20, 2025 · FAU assembly solution as well as PIC warpage control are crucial for this Photonic Non-mold 2.5D structure. This design offers better thermal dissipation and can achieve higher …

Intel, Samsung, and TSMC are leaders in the high-end performance packaging market space and key innovators in the field. With 2.5D and 3D technologies, these big players are now offering …

May 4, 2025 · Explore 2.5D & 3D advanced packaging. Understand core principles, key differences, manufacturing challenges, HBM/Chiplet use cases & heterogeneous integration …

Jul 17, 2025 · The path to greater performance, power efficiency, and functionality now runs through advanced packaging. This first article in our series explores this fundamental shift, …

Jun 1, 2025 · At the 2025 IEEE ECTC, TSMC’s silicon photonics division published a new paper that further strengthens the COUPE concept. Led by TSMC Vice President K.C. Hsu, this work …

Dec 1, 2024 · This article explores the evolution of packaging methods, the advantages of 2.5D technology such as enhanced performance and thermal management, and its future trends in …

Two prominent packaging approaches—Face-Down (Photonic FOPOP) and Face-Up (Photonic Non-Mold 2.5D)—offer unique trade-offs in design, performance, and material integration. 🔻...

Jun 24, 2025 · In this article, we’ll break down the key differences between 2.5D vs. 3D IC, explore their use cases, and examine how the industry is evolving to support next-generation …

Evolving 2.5D Interposer Technology New semiconductor families are emerging that demand greater interconnect densities than possible with today’s organic substrate fabrication technology.

May 10, 2024 · By 2025, TSMC aims to complete the preliminary validation of silicon photonics for supporting small pluggable COUPE connectors, which, combined with CoWoS packaging, will …