Taiwan computer chip maker TSMC has reported its profit in the last quarter rose 57%, buoyed by the artificial intelligence boom.

Taiwan Semiconductor Manufacturing Co logged record quarterly profit on Thursday and said it expects robust revenue growth in the first three months of the year as demand surges for chips used in artificial intelligence processing.

Hong Kong schools are seeing a surge in flu outbreaks, health authorities have said, with the city’s forecaster issuing a cold weather warning as temperatures drop. Albert Au Ka-wing, head of the Centre for Health Protection Communicable Disease Branch, told a radio programme on Friday that the city had entered the flu season.

U.S.-listed shares of Taiwan Semiconductor Manufacturing Co. rose in premarket trading Thursday after the world's largest contract chip manufacturer posted better-than-expected fourth-quarter profit and a bullish outlook for artificial intelligence demand.

Hong Kong officials held rare talks in Bangkok this week with Thai counterparts to find ways to bring home those lured from the Asian financial hub and trapped in illegal work in Southeast Asia, seeking to combat a growing trend.

Taiwan computer chip maker TSMC reported Thursday that its profit in the last quarter rose 57%, buoyed by the artificial intelligence boom.

HONG KONG (AP) — Taiwan computer chip maker TSMC reported Thursday that its profit in the last quarter rose 57%, buoyed by the artificial intelligence boom. The world’s biggest semiconductor ...

Hong Kong has a free market economy, highly dependent on international trade and finance - the value of goods and services trade, including the sizable share of reexports, is about four times GDP.

Concerts will be held at 50,000-seat Kai Tak Stadium on April 25 and 26, with ticket prices starting at HK$680.

When asked if the chipmaker was prepared for Donald Trump's return to office, TSMC Chairman and CEO C.C. Wei on Thursday said his company has "very frank and open communication" with both the ...

That also shows how TSMC’s advanced packaging technology—chip on wafer on substrate (CoWoS)—is evolving to overcome interconnect battles inside large, powerful chips for AI and other high-performance computing (HPC) applications. The CoWoS-S advanced ...