Singapore, Micron

Micron Technology (NASDAQ:MU) announced a US$7 billion investment to build a high-bandwidth memory (HBM) chip-packaging facility in Singapore to meet rising global demand for artificial intelligence ...
Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at ...
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...
Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...